Printed Circuit Boards: Design, Fabrication, and Assembly
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They now include finer conductor tracks and thinner laminates, present in an ever-increasing number of layers. Integrated circuits have become dramatically sophisticated especially in the last decade. This has in turn created new design requirements for mounting them on the boards. While insertion was common with DIP (dual in- line-package) technology in the 1970s, surface mount technology in now being increasingly employed. holes is increasing; and hole diameters are rapidly decreasing.
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