Sổ tay RFID (P12)

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Sổ tay RFID (P12)

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Module manufacture In accordance with the normal semiconductor manufacturing procedure, the microchip is produced on a so-called wafer. This is a slice of silicon, which may be 6 inches in diameter, upon which several hundred microchips are produced simultaneously by repeated doping, exposure, etching and washing of the surface. In the next stage of production, the microchips on the wafer are contacted using metal points and then each of the chips is individually tested for functionality.

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