Tuyển tập báo cáo các nghiên cứu khoa học quốc tế ngành hóa học dành cho các bạn yêu hóa học tham khảo đề tài: Research Article Nearest Neighborhood Grayscale Operator for Hardware-Efﬁcient Microscale Texture Extraction
(BQ) Part 2 book "Chemistry experiments" has contents: Microscale percent composition, levels of sugar, thin layer chromatography, the rate of rusting, chloride levels, heat energy, chemical moles, finding molar mass, endothermic and exothermic reactions, solutions and spectrophotometry.
(BQ) Part 2 book "Handbook of heat transfer" has contents: Microscale transport phenomena, heat transfer in porous mediac, nonnewtonian fluids, techniques to enhance heat transfer, heat pipes, heat transfer in packed and fluidized beds, condensation,...and other contents.
The development and deployment of NEMS and MEMS are critical to the U.S. economy and society because nano- and microtechnologies will lead to major breakthroughs in information technology and computers, medicine and health, manufacturing and transportation, power and energy systems, and avionics and national security.
Most solar modules used in photovoltaics are currently produced from crystalline and
polycrystalline silicon wafers, the representatives of so-called first generation of solar
cells. This type of devices are among the most efficient but at the same time the most
expensive since they require the highest purity silicon and involve a lot of stages of
complicated processes in their manufacture.
A large variety of nano- and microscale structures and devices, as well as NEMS and MEMS (systems integrate structures, devices, and subsystems), have been widely used, and a worldwide market for NEMS and MEMS and their applications will be drastically increased in the near future. The differences in NEMS and MEMS are emphasized, and NEMS are smaller than MEMS. For example, carbon nanotubes (nanostructure) can be used as the molecular wires and sensors in MEMS. Different specifications are imposed on NEMS and MEMS depending upon their applications.
In the past decades, significant advances in tribology have been made as engineers
strive to develop more reliable and high performance products. The advancements are
mainly driven by the evolution of computational techniques and experimental
characterization that leads to a thorough understanding of tribological process on both
macro- and microscales.
Currently, the development of products at the nano- and microscale is being driven by economic
necessity in highly developed countries in order to improve the quality of life, and in recent years
to prevent the spread of global terrorism. Nanotechnology is seen as the next step in the industrial
revolution and, as such, requires manufacturing processes that will revolutionize the way small
products are made. The promises offered by nanotechnology will change the way we exist.
Silicon technology continues to progress, but device scaling is rapidly
taking the metal oxide semiconductor field-effect transistor (MOSFET) to its
limit. When MOS technology was developed in the 1960's, channel lengths
were about 10 micrometers, but researchers are now building transistors with
channel lengths of less than 10 nanometers. New kinds of transistors and
other devices are also being explored. Nanoscale MOSFET engineering
continues, however, to be dominated by concepts and approaches originally
developed to treat microscale devices...
During the last 20 years the nanotechnology has been a demand of the worldwide
technology. In the early 1990s the microscale technology was almost fully understood
and the scientists tried to find a solution how to miniturize electronic devices and en-
gineering applications to a microscale level. At that time they already had the evidence
that this is possible particularly due to fast development of microscope test equip-
ments and facilities.
The Millennium Ecosystem Assessment (MA) was carried out between 2001
and 2005 to assess the consequences of ecosystem change for human well-being
and to establish the basis for actions needed to enhance the conservation and
sustainable use of ecosystems and their contributions to human well-being.
Most manufacturing technologies for metallic microstructures
have their roots either in semiconductor (inmost cases, silicon) device production or
in conventional precision machining. Of these, the techniques that are well known
have been used formicrostructure dimensions. Further, they have been adapted and
improved to reach the desired precision and surface quality. In some rare cases, itwas
possible to use the same manufacturing process for macroscale and microscale
devices and to get the desired results.
Thrombopoietin is the primary regulator of platelet production. We exploi-ted two naturally occurring miniproteins of the inhibitor cystine knot fam-ily as stable and rigid scaffolds for the incorporation of peptide sequences
that have been shown to act as high-affinity thrombopoietin antagonists.
Several miniproteins that antagonistically block thrombopoietin-mediated
receptor activation were identified using a microscale reporter assay.
This book presents a mathematical development of a recent approach to
the modeling and simulation of turbulent flows based on methods for
the approximate solution of inverse problems. The resulting Approximate
Deconvolution Models or ADMs have some advantages (as well as some
disadvantages) over more commonly used turbulence models:
ADMs are supported by a mathematically rigorous theoretical foundation.
ADMs are a family of models of increasing accuracy O(δ2N+2), where δ is
the averaging (or filter) radius...
The electrospinning technique for the scaffolds designing utilizes the electrostatic force for
the production of polymeric fiber ranging from nanoscale to microscale. This process is
control by high intensity electric field between two electrodes having electric charges of
opposite polarity. One electrode is placed in the polymer solution and other is placed in
collector. Generally polymer solution is pumped as result in forming a drop of solution.
(BQ) Part 2 book "Heat transfer handbook" has contents: Heat exchangers, heat transfer in electronic equipment, heat transfer enhancement, porous media, heat pipes, heat transfer in manufacturing and materials processing, microscale heat transfer, direct contact heat transfer.