Why do FA?
To understand the root cause of device failure
Allow intelligent corrective actions to be
Determine where in a process issues exist that
Check for counterfeit materials
- My boss/customer said I have too
Case Study packaged IC second
As with micromachining processes, many MEMS sensor-packaging techniques are
the same as, or derived from, those used in the semiconductor industry. However,
the mechanical requirements for a sensor package are typically much more stringent
than for purely microelectronic devices. Microelectronic packages are often generic
with plastic, ceramic, or metal packages being suitable for the vast majority of IC
ASIC (Application Specific IC). IC and PGA package (Pin Grid Array) (hình 1.1).
Tính toán kích cỡ IC: theo số lượng cổng (logic-gate hay transistor) bên trong IC.
Đơn vị tính kích cỡ IC là NAND hoặc NOR gate. Ví dụ: 100k-gate = 100.000 two-
input NAND gates. 2-input NAND gate = 4 CMOS transistors. Tương tự cho NOR
gate. (xem chương dẫn nhập)
Consumer packaged goods companies are always challenged to introduce new
product innovation that strongly resonates with consumers and that sets them
apart from products currently in the market. An Ipsos global survey showed
consumers rank food and beverage, personal and household products low on
the list of innovative products compared to computer equipment and electron-ics (Palmer, 2009).