Solder interconnections

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  • Recrystallization is a phenomenon moderately well documented in the geological and metallurgical literature. This book provides a timely overview of the latest research and methods in a variety of fields where recrystallization is studied and is an important factor. The main advantage of a new look at these fields is the rapid increase in modern techniques, such as TEM, spectrometers and modeling capabilities, all of which are providing us with far better images and analysis than ever previously possible....

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  • CHAPTER 16 ELECTRONIC PACKAGING Warren C. Fackler, RE. Telesis Systems, Inc. Cedar Rapids, Iowa 16.1 INTRODUCTION 16.1.1 Scope 16.1.2 Overview 16.1.3 Design Techniques COMPONENT MOUNTING 16.2.1 General 16.2.2 Specific Components 16.2.3 Discrete Components 16.2.4 Printed Circuit Board Components FASTENINGANDJOINING 16.3.1 General 16.3.2 Mechanical Fastening 16.3.3 Welding and Soldering 16.3.4 Adhesives INTERCONNECTION 16.4.1 General 16.4.2 Discrete Wiring 16.4.3 Board Level 16.4.4 Intramodule 16.4.5 Intermodule 16.4.6 Interequipment 16.4.7 Fiber-Optic Connections MATERIALSSELECTION 16.5.

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  • KRONE has a long history as a market leader in the communications and information industry. Founded in 1928 by Gustav Krone, the KRONE Group is one of the world’s leading suppliers of the interconnection and distribution systems used in telecommunications and data networks. KRONE is represented in 140 countries around the globe by 29 subsidiaries, 80 sales partners and approximately 3,000 employees.

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