Surface micromachining

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  • Sophisticated miniaturised components and systems may indeed change all kinds of products and equipment in the most dramatic way. Methodology and design of miniaturisation represent a broad research topic with applications in fundamental physics, chemistry, martial science, computing methods, ultra-precision engineering, fabrication technology, micromachining, and many others based on the principles, characterization, modeling, simulation, sophistication, flexibility of state-of-the-art technology.

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  • Within a period of a few decades, the ¯eld of materials science and engineering has emerged as a focal point for developments in virtually all areas of engineering and applied science. The study of thin film materials has been one of the unifying themes in the development of the ¯eld during this period. As understood here, the area encompasses ¯lms bonded to relatively thick substrates, multilayer materials, patterned ¯lms on substrates and free-standing ¯lms.

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  • Muller, R.S. “Microdynamic Systems in the Silicon Age” Handbook of Micro/Nanotribology. Ed. Bharat Bhushan Boca Raton: CRC Press LLC, 1999 © 1999 by CRC Press LLC Microdynamic Systems in the Silicon Age Richard S. Muller 13.1 Introduction Origins 13 13.2 Micromachining Substrate Micromachining • Surface Micromachining • Polycrystalline Silicon Properties • Tribology in MEMS 13.3 MEMS Structures and Systems MEMS Actuation Forces • MEMS for Microphotonics • Coupling Efficiency 13.

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  • Micromechanical photonics is evolvingin interdisciplinary research and engineering fields and merging independently developed technologies based on optics, mechanics, electronics, and physical/chemical sciences. Manufacturing technologies such as those of semiconductor lasers, surface micromachining and bulk micromachiningare promotingtec hnology fusion.

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  • Although assembling of a number of device parts is not really a problem in the macroscaleworld, it needs to be delicately handled in themicroscaleworld. Themain point is the adjustment and alignment accuracy of the parts. Moreover, problems of sealing, fixation and bonding technology may also occur depending on the material and the parameters of the designated process of the device.Depending on the surface quality and the bonding technology applied, aligning errors may reach similar dimensions compared to themicrostructure itself. An example of the same is shown in Figure 1.11.

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  • Polymer micromolding is a common way to ma microchannels, because of the ease of processing, low co and bio-compatibility. Molds with micron-scale featur may be made from photosensitive polymers (e.g., SU-8) by DRIE silicon micromachining. Poly(dimethylsiloxan (PDMS) is often chosen as the microstructural materi [15]. PDMS is spin cast onto the mold, cured and peel off. A short exposure in an oxygen plasma activates t PDMS surface and results in instant bonding to oth PDMS or glass surfaces.

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