Wafer fabrication

Xem 1-14 trên 14 kết quả Wafer fabrication
  • Sau khi vỗ, wafer được rất phẳng, bề mặt thô. Hơn nữa trên đầu trang của các xốp, có một lớp định hướng thường được các nguyên tử các bị tác động. Những lớp này bị hư hỏng loại bỏ trong một khắc hóa chất thủ tục.

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  • Sophisticated miniaturised components and systems may indeed change all kinds of products and equipment in the most dramatic way. Methodology and design of miniaturisation represent a broad research topic with applications in fundamental physics, chemistry, martial science, computing methods, ultra-precision engineering, fabrication technology, micromachining, and many others based on the principles, characterization, modeling, simulation, sophistication, flexibility of state-of-the-art technology.

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  • It is hard to imagine that less than fifteen years ago building and fire codes specific to the construction of a wafer fabrication facility were just in the process of being developed. Detection and evaluation of leaking underground storage tanks and epidemiological health studies aimed at qualifying and quantifying our “cleanroom” image were in their infancy stages and Cal- OSHA had just completed the first in-depth study of the industry’s chemical processes and associated industrial hygiene exposures....

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  • Tham khảo sách 'corrosion resistance_2', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả

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  • The book titled “Corrosion Resistance” has a significant meaning because the terminology “Corrosion Resistance” is one of the most important indications of materials under corrosion study and characterization. The book has covered the state-of-the-art technologies, development, and research progress of corrosion studies in a wide range of research and application fields. The authors have contributed their chapters, each on their special field, on corrosion characterization and corrosion resistance....

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  • In modern research and development, materials manufacturing crystal growth is known as a way to solve a wide range of technological tasks in the fabrication of materials with preset properties. This book allows a reader to gain insight into selected aspects of the field, including growth of bulk inorganic crystals, preparation of thin films, low-dimensional structures, crystallization of proteins, and other organic compounds.

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  • Tham khảo sách 'corrosion resistance_1', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả

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  • Computer Techniques Computer Hided and Integrated Manufacturing Systems II S-Volume Sel Cornelius T Leondes .Vol.l Computer Techniques C o m p u t e r H i d e d and Integrated Manufacturing Systems A S-Volume Set .This page is intentionally left blank .Vol.l Computer Techniques C o m p u t e r R i d e d and Integrated Manufacturing Systems H S-Volume Ser Cornelius TLeondes Unifmity of Calikmia, Lm Angeles, USA I j f e World Scientific IM New Jersey 9 London • Singapore • Hong Kong .Published by World Scientific Publishing Co. Pte. Ltd.

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  • To maximize the extent of the photonic bandgap in a finite-height photonic-crystal (PhC) slab one can increase the fill-factor in the PhC lattice. Among the realistic choices of possible 2D lattices, high fill- factor triangular lattices of cylindrical holes in a high index dielectric, namely silicon, are by far the most commonly used. In this paper, we present a method for fabrication of very high fill-factor PhC devices in silicon-on-insulator (SOI) substrates using electron-beam lithography and high-aspect-ratio reactive-ion etching (RIE).

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  • Kang et al. Nanoscale Research Letters 2011, 6:236 http://www.nanoscalereslett.com/content/6/1/236 NANO EXPRESS Open Access Anti-reflective nano- and micro-structures on 4H-SiC for photodiodes Min-Seok Kang1, Sung-Jae Joo2, Wook Bahng2, Ji-Hoon Lee1, Nam-Kyun Kim2, Sang-Mo Koo1* Abstract In this study, nano-scale honeycomb-shaped structures with anti-reflection properties were successfully formed on SiC. The surface of 4H-SiC wafer after a conventional photolithography process was etched by inductively coupled plasma.

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  • Water scarcity directly impacts business activities, raw material supply, intermediate supply chain, and product use in a variety of ways. Declines or disruptions in water supply can undermine industrial and manufacturing operations where water is needed for production, irrigation, material processing, cooling and/or washing and cleaning.

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  • Several techniques for fabrication of through-wafer vias in silicon have been compared in terms of achievable via diameter, shape and geometry and their influence on mechanical strength of silicon dies/wafers. Assessed techniques are: powder blasting, laser melt cutting, laser ablation, and deep reactive ion etching. The resolution of each method and influence on geometry was evaluated by fabrication through-wafer holes and slots in 240µm-thick silicon wafers. The mechanical strength is measured using ring-on-ring (RoR) and four-point bending methods.

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  • In the MEMS industry, systems for deep reactive-ion etching (DRIE) utilize fast pumping, fast-response mass-flow controllers inductive coupling of power, and heated chamber and pump lines that are critical to achieve reliable etch rates. In contrast, we have achieved 8:1 aspect-ratio PhC structures with 62nm vertica membrane walls using a standard reactive-ion etching process based on a sidewall passivation processes. In the remainder of this section we discuss this fabrication process.

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  • Owing to the diffusion ofmaterial fromone foil to another, no borderline limitations between single foils in terms of heat transfer exist any more. Thus, the thermal behavior of diffusion-bonded devices is superior in comparison to that of the devices manufactured by other bonding techniques. In Figure 1.13, the diffusion bonding process chain is shown clockwise, starting with the single foils stack of a cross-flow stainless steel device. Figure 1.14 shows a cut through a diffusion-bonded stainless steel device.

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