Mechanical Engineer´s Handbook P73
CHAPTER 54 COOLING ELECTRONIC EQUIPMENT
Allan Kraus
Allan D. Kraus Associates Aurora, Ohio
54.1
THERMAL MODELING 54. 1 . 1 Introduction 54. 1 .2 Conduction Heat Transfer 54.1.3 Convective Heat Transfer 54.1.4 Radiative Heat Transfer 54.1.5 Chip Module Thermal Resistances HEAT-TRANSFER CORRELATIONS FOR ELECTRONIC EQUIPMENT COOLING 54.2.1 Natural Convection in Confined Spaces
1649 1 649 54.3 1649 1652 1655 1656
54.2.2
Forced Convection
1662 1667 1672 1672 1674
THERMAL CONTROL TECHNIQUES 54.3.1 Extended Surface and Heat Sinks 54.3.2 The Cold Plate 54.3.3 Thermoelectric Coolers
54.2
1661 1661
54.1
THERMAL MODELING
54.1.1 Introduction To determine the temperature differences encountered in the flow of heat within electronic systems, it is necessary to recognize the relevant heat...
