Mechanical Engineer´s Handbook P73

CHAPTER 54 COOLING ELECTRONIC EQUIPMENT Allan Kraus Allan D. Kraus Associates Aurora, Ohio 54.1 THERMAL MODELING 54. 1 . 1 Introduction 54. 1 .2 Conduction Heat Transfer 54.1.3 Convective Heat Transfer 54.1.4 Radiative Heat Transfer 54.1.5 Chip Module Thermal Resistances HEAT-TRANSFER CORRELATIONS FOR ELECTRONIC EQUIPMENT COOLING 54.2.1 Natural Convection in Confined Spaces 1649 1 649 54.3 1649 1652 1655 1656 54.2.2 Forced Convection 1662 1667 1672 1672 1674 THERMAL CONTROL TECHNIQUES 54.3.1 Extended Surface and Heat Sinks 54.3.2 The Cold Plate 54.3.3 Thermoelectric Coolers 54.2 1661 1661 54.1 THERMAL MODELING 54.1.1 Introduction To determine the temperature differences encountered in the flow of heat within electronic systems, it is necessary to recognize the relevant heat...