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Wet-chemical porosification of LTCC substrates: Dissolution mechanism and mechanical properties

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Low temperature co-fired ceramics (LTCC) technology has been successfully used in microelectronics, automotive, and telecommunication applications. However, their generally high permittivity is unfavorable for micromachined devices operated at high frequencies.

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Nội dung Text: Wet-chemical porosification of LTCC substrates: Dissolution mechanism and mechanical properties

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