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Mechanical sensor packaging

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  • As with micromachining processes, many MEMS sensor-packaging techniques are the same as, or derived from, those used in the semiconductor industry. However, the mechanical requirements for a sensor package are typically much more stringent than for purely microelectronic devices. Microelectronic packages are often generic with plastic, ceramic, or metal packages being suitable for the vast majority of IC applications.

    pdf281p longmontran 18-01-2010 132 55   Download

  • Gyroscopic precession is a key factor involved in the concept of operation for the north-seeking gyrocompass, as will be discussed later. Friction in the support bearings, external influences, and small imbalances inherent in the construction of the rotor cause even the best mechanical gyros to drift with time. Typical systems employed in inertial navigation packages by the commercial airline industry may drift about 0.1 during a 6-hour flight [Martin, 1986]. 2.1.

    pdf20p longtuyenthon 27-01-2010 93 25   Download

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