Mems structure fabrication

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  • The research of optimal condition for etching silicon in TMAH solution with controlled etch rate and low surface roughness is the purpose of this study. The investigation on the influence of temperature, agitation, size of etch-window, etch time on etch rate and the surface roughness were carried out. With the TMAH concentration of 20% in weight, the optimal etching conditions were as follows: temperature of about 80 – 90 oC, agitation of 150 - 200 rpm. The etch rate is controlled in range of 0.49 – 0.72 µm/min. ...

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  • Many people in the field of microelectromechanical systems (MEMS) share the belief that a revolution is under way. As MEMS begin to permeate more and more industrial procedures, not only engineering but society as a whole will be strongly affected. MEMS provide a new design technology that could rival, and perhaps even surpass, the societal impact of integrated circuits (ICs). Is this fact or fiction? If it is fact, then several questions must be asked.

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  • Making microsystems at a scale level of few microns is called micromachining. Micromachining is used to fabricate three-dimensional microstructures. It is the foundation of a technology called Micro-Electro-Mechanical-Systems (MEMS). MEMS usually consist of three major parts: sensors, actuators, and an associate electronic circuitry that acts as the brain and controller of the whole system.

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  • This book is designed for a one-semester course on Nano- and Microelectromechanical Systems or Nano- and Microengineering. A typical background needed includes calculus, electromagnetics, and physics. The purpose of this book is to bring together in one place the various methods, techniques, and technologies that students and engineers need in solving a wide array of engineering problems in formulation, modeling, analysis, design, and optimization of high-performance microelectromechanical and nanoelectromechanical systems (MEMS and NEMS).

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  • Microelectromechanical systems are moving from the simple single-function devices of the past to more elaborate systems with complex structural intricacies with rich dynamic subtleties. However, despite the relatively large number of CAD for MEMS tools, products, and vendors, MEMS design today still largely consists of working at the whiteboard with colleagues and entering simplified equations into Mathcad, if not writing them by hand on the back of an envelope. Today’s CAD tools are useful for design verification, but are not often used in the early phases of design.

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  • Muller, R.S. “Microdynamic Systems in the Silicon Age” Handbook of Micro/Nanotribology. Ed. Bharat Bhushan Boca Raton: CRC Press LLC, 1999 © 1999 by CRC Press LLC Microdynamic Systems in the Silicon Age Richard S. Muller 13.1 Introduction Origins 13 13.2 Micromachining Substrate Micromachining • Surface Micromachining • Polycrystalline Silicon Properties • Tribology in MEMS 13.3 MEMS Structures and Systems MEMS Actuation Forces • MEMS for Microphotonics • Coupling Efficiency 13.

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  • The fundamental aim of microengineering — to take a design from a computer aided design (CAD) software package and manifest it in a physical manner — may be achieved through one of a number of different fabrication or micromachining technologies. Many of these technologies employ a process known generally as photolithography , or a variation of this process, to transfer a two-dimensional pattern from a mask into the structural material.

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  • The term “CMOS MEMS” most often describes pro- cesses that create microstructures directly out of the metal/ dielectric interconnect stack in foundry CMOS. The metal- lization and dielectric layers, normally used for electrical interconnect, now serve a dual function as structural layers. For example, the suspended n-well of Figure 3(d) is consid- ered CMOS MEMS, since its beam suspension is made from the CMOS interconnect stack. There is significant motivation for making MEMS out of CMOS. Leveraging foundry CMOS for MEMS is fast, reliable, repeatable, and economical.

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  • The first reported CMOS-MEMS processes produce microstructural sidewalls by stacking the drain/source con- tact cut and metal via cuts in the CMOS and removing the metallization layers above the cuts [13]. The substrate is exposed in the cut regions. A wet or dry isotropic silicon etch undercuts and releases the microstructures. Gaps between microstructures are limited to several microns because of artifacts in the etch pits from etching metal above the CMOS contacts.

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  • In the MEMS industry, systems for deep reactive-ion etching (DRIE) utilize fast pumping, fast-response mass-flow controllers inductive coupling of power, and heated chamber and pump lines that are critical to achieve reliable etch rates. In contrast, we have achieved 8:1 aspect-ratio PhC structures with 62nm vertica membrane walls using a standard reactive-ion etching process based on a sidewall passivation processes. In the remainder of this section we discuss this fabrication process.

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