Resistance to sinking

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  • Rawson and Tupper's Basic Ship Theory, first published in 1968, is widely known as the standard introductory text for naval architecture students, as well as being a useful reference for the more experienced designer. The fifth edition continues to provide a balance between theory and practice. Basic Ship Theory is an essential tool for undergraduates and national vocational students of naval architecture, maritime studies, ocean and offshore engineering, and this combined hardback version will be of great assistance to practising marine engineers and naval architects.c...

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  • Due to their low aqueous solubilities, the PCBs and PAHs lay on the surface of soils and waters. PCBs and PAHs adsorb strongly to the organic fraction of soils (Girvin & Scott, 1997; Hiller et al., 2011). Soils contaminated with PCBs and PAHs are transported directly or indirectly by rivers to the water reservoir and are subsequently converted into the bed sediments. Therefore, soils could be considered as the primary sinks for these organic contaminants. PCBs and PAHs are persistent in the environment, resistant to degradation process, and accumulate in food chain.

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  • Atmospheric levels of CO2 have risen significantly from preindustrial levels of 280 parts per million (ppm) to present levels of 384 ppm (Tans, 2008). Evidence suggests the observed rise in atmospheric CO2 levels is the result of expanded use of fossil fuels for energy. Predictions of increased global energy use during this century indicate a continued increase in carbon emissions (EIA, 2007) and rising concentrations of CO2 in the atmosphere unless major changes are made in the way energy is produced and used; in particular, how carbon is managed (Socolow et al.

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  • CHAPTER 54 COOLING ELECTRONIC EQUIPMENT Allan Kraus Allan D. Kraus Associates Aurora, Ohio 54.1 THERMAL MODELING 54. 1 . 1 Introduction 54. 1 .2 Conduction Heat Transfer 54.1.3 Convective Heat Transfer 54.1.4 Radiative Heat Transfer 54.1.5 Chip Module Thermal Resistances HEAT-TRANSFER CORRELATIONS FOR ELECTRONIC EQUIPMENT COOLING 54.2.1 Natural Convection in Confined Spaces 1649 1 649 54.3 1649 1652 1655 1656 54.2.2 Forced Convection 1662 1667 1672 1672 1674 THERMAL CONTROL TECHNIQUES 54.3.1 Extended Surface and Heat Sinks 54.3.2 The Cold Plate 54.3.3 Thermoelectric Coolers 54.

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