FA at ISE Labs

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Why do FA? To understand the root cause of device failure Allow intelligent corrective actions to be applied Determine where in a process issues exist that affecting product Check for counterfeit materials - My boss/customer said I have too Case Study packaged IC second level Opens

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Nội dung Text: FA at ISE Labs

FA at ISE Labs FA at ISE Labs By Dr. Daniel J. D. Sullivan and Jesse Guzman October 15, 2010
ISE LABS Agenda Introduction FA Example “Packaged IC second level Opens” FA Example “Flip-Chip Shorting” Flip FA example “PV Solar Cell” Reltron Reltron presentation Q&A Lab tour Lunch! Excellence Expertise Service ● ●
ISE LABS Who is the FA lab at ISE? Dr. Daniel Sullivan Lab manager ● PhD Chemistry UCSD, BS UC Berkeley ● 16 years in FA/Material labs FA/M ● 1.5 years solar FA and reliability ● Jesse Guzman FA Engineer ● MS Physics UCSC, BS Physics Univ. of Michigan ● 3 years acoustic microscopy, 1 year FA FA ● Sinai Galvan Technician ● Excellence Expertise Service ● ●
ISE LABS Why do FA? To understand the root cause of device failure dev Allow intelligent corrective actions to be applied Determine where in a process issues exist that affecting product Check for counterfeit materials My boss/customer said I have too … Excellence Expertise Service ● ●
ISE LABS Why do FA at ISE? Staff experience Materials/FA Die, package and board level, Cu bond wire ICs ● Solid state lasers and LEDs ● MEMs, components ● Welds and brazing ● Disk Drives ● Solar panels and components ● Medical devices ● Reinvesting in equipment set 2009 New SEM/EDX, optical microscopes, decap tool, D-24 C-SAM ● 2010 Emission system, dye and pry, Allied Tech Prep, Upgrade D-9000 C-SAM Alli ● 2011 …Suggestions? (Laser decap? Hardness testing? IR Thermal Imaging?) ● Supporting labs (one stop testing) Reliability ● ESD ● Burn-In ● ATE Test ● Excellence Expertise Service ● ●
Case Study packaged IC second Case Study packaged IC second level Opens
ISE LABS Case of board mounted device with opens Excellence Expertise Service ● ●
ISE LABS Start Non-destructively X-ray imaging To look for missing or deformed solder balls ● C-SAM To check device wire bonds and substrate integrity ● Excellence Expertise Service ● ●
ISE LABS X-ray image Excellence Expertise Service ● ●
ISE LABS Acoustic (C-SAM) image Excellence Expertise Service ● ●
ISE LABS Check secondary attach Cross section to check for cracking in one row to Enables close scrutiny of the attach points, voids ● inside solder, structural damage internal to device Dye and Pry to check all solder balls at once Checks cracking of all solder balls at once ● Dye must have access to crack to stain ● Must completely dry before detaching ● Excellence Expertise Service ● ●
ISE LABS Dye and Pry Good Bad Excellence Expertise Service ● ●
ISE LABS Results Red dye shows multiple solder balls were ed balls completely detached Board had been flexed resulting in cracked solder balls Quick, whole analysis took one day Excellence Expertise Service ● ●
Flip-Chip Shorting Failure Analysis Case Study Study By Jesse Guzman Jesse Guzman
ISE LABS Symptoms Part failed electrically with shorts Optical inspection of part reveals nothing unusual Parts have undergone stress testing New vendor has done the bumping Start Start with non-destructive testing – C-SAM Excellence Expertise Service ● ●
ISE LABS Underfill Delamination: Flip Chip – CSAM 26mm x 26mm die size (large) Some underfill delamination acceptable by customer’s customer’s specs Vendor customer dispute dispute root cause Need to physically inspect the die to underfill interface to prove to the packaging vendor that the issue is real. Excellence Expertise Service ● ●
ISE LABS Underfill Underfill Delamination: Cross-section Looking for Physical Evidence of the Delamination Customer sent the C-SAM results to the vendor for destructive FA. Vendor’s FA reported no delamination… Customer requested cross-section be sent to ISE. The sample was then only polished and cleaned, then imaged. Excellence Expertise Service ● ●
ISE LABS Underfill Underfill Delamination: Cross-section Looking for Physical Evidence of the Delamination Optical imaging after polish SEM imaging after polish and cleaning and cleaning Excellence Expertise Service ● ●
ISE LABS Shorts: die or package or interconnect Multiple samples available Choice #1: Grind away the package to leave the solder bump tops and die Choice #2: Grind away die into solder bumps to #2 di leave the substrate and solder bump bottoms Eith Either choice will clear the die or the substrate. th di th This leaves the interfaces and die/substrate to inspect further. Excellence Excellence Expertise Service ● ●
ISE LABS Shorts: First - Check the Substrate Parallel lap away the solder balls balls and the substrate Some issues with the solder bumps, but no shorts visible Upon electrical testing, bumps are still shorted Substrate is not the issue Substrate manufacturer is off the hook; breathes a loud sigh of relief. Need to physically image the die to bump interface. Excellence Expertise Service ● ●