Lecture ECE 6450 Microelectronic

Lecture ECE 6450 Microelectronic - Chapter 7: Lithography and pattern transfer. After studying this section will help you understand PR pattern is same as mask. On exposure to light, light degrades the polymers (described in more detail later) resulting in the photoresist being more soluble in developers. The PR can be removed in inexpensive solvents such as acetone.

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Lecture Introduction to microelectronic technologies - Chapter 1: The importance of multidisciplinary understanding. After studying this section will help you understand mphasis will be placed on multidisciplinary understanding using concepts from Electrical Engineering, materials science/engineering, chemistry, physics, and mechanical engineering.

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Lecture ECE 6450 Microelectronic - Chapter 2: Semiconductor substrates. After studying this section will help you understandcertain compositions of materials are allowed at a given temperature and pressure when the material is in thermodynamic equilibrium. These compositions can be described by “Phase Diagrams”. These allowed compositions effect semiconductor growth, and dictate the stability and electrical properties of metalsemiconductor contacts.

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Lecture ECE 6450 Microelectronic - Chapter 3: Diffusion. After studying this section will help you understand chemical source in a vapor at high temperature. Doped oxide source (either deposited at high temperature or as a “Spin on polymer). Diffusion/annealing from an Ion implanted source.

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Lecture ECE 6450 Microelectronic - Chapter 4: Oxidation (applies to Si and SiC only). After studying this section will help you understand the ability to grow a high quality thermal oxide has propelled Si into the forefront of all semiconductor technology. Some present day efforts are being made to produce SiGe channel transistors to marry the benefits of Si (good oxides) with the speed of Ge.

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Lecture ECE 6450 Microelectronic - Chapter 5: Ion implantation. After studying this section will help you understand ions (charged atoms or molecules) are created via an enormous electric field stripping away an electron. These ions are filtered and accelerated toward a target wafer, where they are buried in the wafer. The depth of the implantation depends on the acceleration energy (voltage).

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Lecture ECE 6450 Microelectronic - Chapter 6: Rapid thermal processing. After studying this section will help you understand Minimize redistribution of dopants, minimal sqrt(Dt) with maximal D (high Temperature) allows repair of damage from ion implantation. Cold walls allow multiple processes to occur without cross contamination. Photochemistry can be exploited.

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Lecture ECE 6450 Microelectronic - Chapter 7: Photoresists and non-optical lithography. After studying this section will help you understand photoresists are constructed from complex hydrocarbon chains known as polymers. Polymers are chains of smaller molecules known as monomers. Polymers are the basis of LCD displays, plastic tubing like PVC, acrylic, simulated leather.

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Lecture ECE 6450 Microelectronic - Chapter 10: Vacuum Technology and plasmas. After studying this section will help you understand deposition techniques such as evaporation, sputtering, , plasma processing, chemical vapor deposition, molecular beam epitaxy, etc…, we must first have a grasp of the manner in which vacuum and gases flow. Thus, we will begin with a discussion of vacuum physics and vacuum techniques.

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Lecture ECE 6450 Microelectronic - Chapter 11: Etching techniques. After studying this section will help you understand Anisotropy can depend on mean Increasing Mean Free Path free path, or on DC plasma bias. Increasing mean free path (generally) increases anisotropy. Increasing DC bias (generally) increases anisotropy.

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Lecture ECE 6450 Microelectronic - Chapter 12: Physical vapor deposition. After studying this section will help you understand Several methods are currently used for deposition of metal layers., Evaporation is based on the concept that there exists a finite “vapor pressure” above any material. The material either sublimes (direct solid to vapor transition) or evaporates (liquid to vapor transition).

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Lecture ECE 6450 Microelectronic - Chapter 13: Thin film deposition and epitaxy (Chemical vapor deposition, metal organic CVD and molecular beam epitaxy). After studying this section will help you understand chemical gas sources are thermally, optically, or electrically (plasma) reacted with a surface to “leave” behind deposits with reaction byproducts pumped out of the reaction tube or vacuum chamber.

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Lecture ECE 6450 Microelectronic - Chapter 15: Process integration. After studying this section will help you understand Consider a lateral npn transistor (makes up a significant percentage of analog devices used).

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